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穎崴科技股份有限公司-產品介紹

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Package Test

Package Test

WinWay’s commitment to technology, quality and service ensures our interface solutions go above and beyond to exceed your expectations. Our products and services have a proven track record of delivering customer success in semiconductor testing. The Company offers comprehensive test interface solutions ranging from wafer-level test, package-level test to thermal management.
Packaging Test
  • 半導體材料與元件的穩定度控制
    710 000

    半導體材料與元件的穩定度控制(模擬文案)

  • 排除生產線異常問題,進行低良率、異常品分析
    1 Gigabit

    排除生產線異常問題,進行低良率、異常品分析(模擬文案)

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