穎崴科技股份有限公司-HyperSocket^TM

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HyperSocket^TM

HyperSocket^TM is a next-generation product specially developed to meet the sensitive contact resistance test requirements, providing soft contact avoiding damage to solder ball. This structure significantly enhances spring probe's lifetime, reduces cleaning frequency, and achieves maximum production efficiency.

Patent NO. TWI862047; TWI862191; CN20570508U

Information

Specifications

	Elastomer	Spring Probe	HyperSocket^TM
Travel (mm)	0.2 ~ 0.3	0.6 ~ 1.0	0.6 ~ 1.0
Contact Resistance (mΩ) @ Recom. Travel	< 50	< 60	25%↓
Contact Resistance (mΩ) @ 0.15mm	< 50	< 70	50%↓
Force (g) @ Recom. Travel	40 ~ 85	10 ~ 35	10 ~ 35
Current Capacity (A)	2.4	3 ~ 3.5	5 ~ 6
Applicable pitch range : 0.4~1.27mm