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穎崴科技股份有限公司-Heatsink Lid

Testing Requirements

Heatsink Lid

In response to the cooling needs of high-power chips, WinWay developed air-cooled and water-cooled manual lids. The heat generated by the chips can be effectively transported through the heat-conducting materials and liquid medium, maintaining the temperature within the target levels. The maximum cooling power of the heat pipe air-cooled manual lid complies with the cooling needs of 850W and

同軸式彈簧針測試座
同軸式彈簧針測試座
同軸式彈簧針測試座
同軸式彈簧針測試座
同軸式彈簧針測試座

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