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WinWay's CPO solution published in《Chip Scale Review》

NOV 30.2022
WinWay Technology Co., Ltd.

WinWay Technology published a recent technical article in the November-December 2022 issue of Chip Scale Review titled "Double-Sided Probing System for 150um Pitch Co-Packaged Optics." For further details, please refer to the attached PDF file.Double-sided probing system_CSR(Scy_C).pdf

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