| Application | Interposer / BGA / LGA |
| Pitch | 0.5 ~ 1.25mm |
| Resistance | < 30mΩ@0.5mm pitch |
| Bandwidth | 25GHz@ -1dB@0.5mm pitch |
| Temperature | -40 ~ 150*C |
| C.C.C | ~4A@0.5mm pitch |
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The interposer is an important signal transmission interface for sending signals from the probe to the probe card PCB substrate. The design of the i-Bump interposer allows for easy installment and replacement. If the design of the probe card is changed or the substrate needs to be replaced, the i-Bump interposer can be directly replaced and quickly assembled without high temperature reflow soldering, effectively reducing replacement or rework time.
| Application | Interposer / BGA / LGA |
| Pitch | 0.5 ~ 1.25mm |
| Resistance | < 30mΩ@0.5mm pitch |
| Bandwidth | 25GHz@ -1dB@0.5mm pitch |
| Temperature | -40 ~ 150*C |
| C.C.C | ~4A@0.5mm pitch |
