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Issued by: WinWay Technology
Date: May 5, 2026
SEMICON Southeast Asia 2026 (SEMICON SEA 2026) officially is unveiled today (May 5) at the Kuala Lumpur Convention Centre, concluded with approximately 750 exhibitors, more than 1,500 booths, attracting over 28,000 visitors from more than 50 countries, according to the official SEMICON SEA. The event is making for a definitive platform for “Connect, Collaborate, Innovate, Transform Tomorrow,” with summit forums covering advanced packaging, smart manufacturing, sustainability, and talent development.
Notably, this year introduces a series of AI-driven application forums (AI4X), including AI for Manufacturing Forum, AI for testing Product Forum, and Cybersecurity. The overall scale continues to expand, making it a premier annual regional event for the global semiconductor ecosystem. Amid the rapid expansion of AI applications, WinWay Technology (TWSE: 6515), a leading provider of semiconductor test interface solutions, is showcasing its comprehensive “AI Plus Total Test Interface Solutions” at SEMICON SEA 2026. Highlights include the next-generation superconducting test socket family, HyperSocket™ Series, high-frequency and high-speed Coaxial Sockets, CPO (Co-Packaged Optics) Solutions, and the liquid cooling thermal solution E-Flux 6.0. The growth outlook for the Southeast Asian semiconductor market remains strong. According to the latest data from Precedence Research, the market is experiencing rapid expansion, with its size projected to reach USD 115.96 billion by 2026, a significant increase from approximately USD 90 billion in 2024. The compound annual growth rate (CAGR) from 2025 to 2034 is estimated at 9.93%, exceeding the global average. To capture this growth, WinWay established a subsidiary in Penang at the end of 2024. This expansion strengthens its regional business and engineering teams while introducing advanced technical services, field application engineering (FAE) support, and system-level test (SLT) capabilities to better serve local IDMs and OSAT customers. Driven by AI, the semiconductor industry is undergoing a paradigm shift. Industry leaders widely anticipate that the global semiconductor market will reach the USD 1 trillion milestone ahead of schedule. As AI tokens are processed is scaling out, reflecting the penetration of AI workflows in our daily life, the semiconductor supply chain is evolving from a traditional hardware manufacturing model into “AI Factories. This paradigm shift is moving the industry beyond hardware competition toward optimizing post-production efficiency. Consequently, advanced process nodes and advanced packaging technologies have become critical points. In response to these trends, WinWay is strategically positioned to capture opportunities in advanced packaging test solutions, CPO, and chiplet technologies. The company continues to expand its portfolio in large package, high-power, and high-frequency/high-speed testing solutions, while also extending into probe cards and scaling up production capacity to support future growth. Mr. Jason Chen, Executive Vice President of Global Business Operations at WinWay Technology, stated that driven by AI computing power, digitalization, and high-performance computing trends, the global semiconductor market is expected to reach the USD 1 trillion milestone earlier than anticipated. At the same time, these trends present new challenges for the semiconductor test interface industry, including larger package sizes, longer test times, higher power consumption, and extended advanced process development cycles. “These challenges will also create unprecedented opportunities for the semiconductor test interface industry,” he added.
