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Wafer Test

Wafer testing is a verified procedure performed during semiconductor device fabrication. During this step, before a wafer test is sent to die preparation, all individual integrated circuits of dies shown on the wafer are tested for functional defects by applying specific test patterns to them. The wafer testing is performed by the test equipment called a wafer prober including probe card where is the probe head structure with Loadboard. The process of wafer testing can be referred to in several ways: Wafer Sort (WS), Wafer Final Test (WFT), Electronic Die Sort (EDS) and Circuit Probe (CP) are probably the most common.

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