Home >> Application >> Wafer Test

Wafer Test

Wafer testing is a verified procedure performed during semiconductor device fabrication. During this step, before a wafer test is sent to die preparation, all individual integrated circuits of dies shown on the wafer are tested for functional defects by applying specific test patterns to them. The wafer testing is performed by the test equipment called a wafer prober including probe card where is the probe head structure with Loadboard. The process of wafer testing can be referred to in several ways: Wafer Sort (WS), Wafer Final Test (WFT), Electronic Die Sort (EDS) and Circuit Probe (CP) are probably the most common.

Related parts

About us
Company Profile
Organization Structure
World Wide
Principle & Vision
Quality & Environmental Policy
Calendar of Events
Social Involvement
High Performance Test Socket
Contact Element
Changeover Kit of Handler
CMOS Test Socket
High Performance Heat Sink/Manual Lid
Vertical Probe Cards
Test Engineering Center
2011©WinWay Tech. Co., Ltd. All rights reserved.
No. 68, Chuangyi S. Rd.,
Second District of Nanzih Export Processing Zone, Nanzih Dist., Kaohsiung City 81156, Taiwan (R.O.C.)
TEL: +886 7 3610999 FAX: +886 7 3610099
Visitors: 00649135